Microchip Technology (Nasdaq: MCHP) has achieved a significant milestone in satisfying mission assurance requirements for critical space programs with its Radiation-Tolerant (RT) RTG4™ Field-Programmable Gate Arrays (FPGAs). These devices, featuring lead-free flip-chip bumps, have earned the Qualified Manufacturers List (QML) Class V status, the highest level of qualification for space components designated by the Defense Logistics Agency (DLA). This qualification is essential for ensuring mission assurance on the most critical space missions, including human-rated and deep space programs.

With standardized QML qualifications based on specific performance and quality criteria set by the DLA, customers can streamline their design and certification processes by utilizing QML-qualified products.

In 2018, the RTG4 FPGAs became the first radiation-tolerant FPGAs to offer over 150,000 logic elements and achieve QML Class V qualification. This next-generation solution is the first of its kind to feature lead-free flip-chip bumps. The advanced flip-chip package construction connects the silicon die to the package substrate, and the use of lead-free bump material contributes to the longevity of the product, which is crucial for space missions.

“This milestone for our RTG4 FPGAs provides customers with increased confidence in designing these devices for space flight systems, while allowing them to benefit from our high-reliability, zero-configuration-upset, and low-power consumption FPGAs,” stated Bruce Weyer, corporate vice president of Microchip’s FPGA business unit. “For over 60 years, Microchip solutions have powered space flight missions, and we remain committed to product longevity and delivering the highest quality solutions.”

RTG4 FPGAs are engineered to deliver high density and performance for space applications, reducing costs and engineering efforts through low power consumption and immunity to configuration upsets. Unlike SRAM-based FPGA alternatives, the programming technology used in RTG4 FPGAs ensures low static power consumption, aiding in the management of thermal issues common in spacecraft.

These FPGAs consume only a fraction of the total power compared to equivalent SRAM FPGAs, while exhibiting zero configuration upsets in radiation, eliminating the need for mitigation and thereby lowering engineering expenses and overall system costs.

To achieve QML Class V qualification, the RTG4 FPGA with lead-free bumps underwent extensive reliability testing, enduring up to 2,000 thermal cycles ranging from −65°C to 150°C junction temperature. The lead-free flip-chip bump interface connections passed MIL-PRF-38535 inspection criteria without exhibiting any signs of tin whiskers. Additionally, since the flip-chip bump is encapsulated within the FPGA package, there is no impact on the user's design, reflow profile, thermal management, or board assembly process when transitioning to lead-free bump RTG4 FPGAs.

Microchip offers one of the industry's most comprehensive portfolios of radiation-hardened and radiation-tolerant solutions, including QML Class Q RT PolarFire® FPGAs and sub-QML FPGAs that bridge the gap between traditional QML components and Commercial Off-The-Shelf (COTS) components. For a complete listing of Microchip FPGA and mixed-signal part numbers alongside their corresponding Defense Logistics Agency (DLA) drawing numbers, please refer to the DLA Cross Reference Guide.

Development Tools

RTG4 FPGAs are supported by a range of development kits, mechanical samples, and daisy-chain packages for board validation and testing. The Libero® SoC Design Suite facilitates RTL entry through programming and includes a comprehensive IP library, complete reference designs, and development kits.